SYSTEMS
Covering all areas of electronics system design, from system architecture to certification
Safety, Redundancy & Availability
The safety group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques, as well as best practice.
Typical Focus topics include :
- Fail Safe & Operational
- Safety Argument
Sensing & Actuation
The sensing group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Intelligent vs Dumb
- Filtering & Filter Design
- Non-Linear Responses
- Diagnostic Capabilities
- Self Healing
- AI Application
System Architecture & Design
The system architecture group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Prototyping
- Simulation System & Actors
- Solution Decision
- Validation & Performance
- Corrective Action
Obsolescence Management
The obsolescence group brings together engineers, quality and supply chain professionals to focus on the challenges and demands of the industry, from tools, to design strategies for mitigating obsolescence issues.
Typical Focus topics include :
- Technology & Tooling Obsolescence
- Modular Replacement Strategies
- Component Attributes
Security, Serialisation & Authentication
The security group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Threat Evaluation
- Security Mechanisms
- Evolutionary Capability
Autonomy & Robotics
The robotics group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Automation
- Communication
- Power
- AI Application
SOFTWARE
Embedded software design and development
Verification & Validation
The verification & validation group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Defect Injection / Removal
- Test & Test Tools
- Review Methods
- Support to System Prototyping
- Support to Hardware Test
Middleware
The Middleware group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Platform Independence
- Performance
- Standards Compliance
Configuration Management
The configuration management group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Configuration Management
- Change Management & Control
- Version Management
- Component & Build Compatibility
- Failure Reporting & Corrective Action
Architecture & Design
The Architecture and Design group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Architecture & Modelling
- Patterns
- Custom vs Reusable
- Intellectual Property
RTOS & Scheduler
The OS & Scheduler group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Performance
- Timing
- Overload Behaviour
- Resource Usage
- Integrity & Evidence
Processes, Methods & Lifecycle
The processes group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Prototyping vs Production
- Waterfall, Ajile, Spiral etc
- QA & Standards Compliance
- Integrity Level
HARDWARE
Encompassing all aspects of electronics hardware development from design through to test.
FPGA & ASIC
A large majority of companies use FPGAs & ASICs in their systems, it is completely hidden from view and its functionality completely integrated to the extent that this technology is often completely unappreciated. The FPGA & ASIC Front Runners Network has been established to provide a platform for coherence in this domain by connecting leading companies across industrial sectors; sustaining and supporting the world-class capability that exists in the UK; developing our agenda to drive a brighter future.
Typical Focus topics include :
- Programming Language
- Performance
- Clock Propagation
- Interfaces
- Design Tools
- Configuration Change & Version Management
- Open Source
Power & Thermal Design
The power & thermal group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques.
Typical Focus topics include :
- Thermal Consideration
- Certification
- Component Selection
EMC & Test
EMC & Test group brings together design engineers to focus on the challenges and demands of the industry, from best practice guidelines, designing for EMC and test techniques and solutions
Typical Focus topics include :
- Radiated & Conducted Emissions
- Susceptibility
- Software Support
Design & Layout
All companies developing electronics, need to start with a design. The design & layout group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques, to CAD tools and best practice.
Typical Focus topics include :
- IC Design & Development
- Single / Double Sided Techniques
- Board Layers
- Test Access / Test Points
- Power Supply
- CAD Tools
- AI Application
Verification & Validation
The verification group brings together design engineers to focus on the challenges and demands of the industry, from design methodologies and techniques, to skills and accessibility.
Typical Focus topics include :
- Test Tools
- Test Environment
- Simulation
- Product Test
- Production Test
Enclosures & Connectors
The enclosures & connectors brings together design engineers to focus on the challenges and demands of the industry, from component choices, industry overviews and best practice.
Typical Focus topics include :
- Physical Interfaces
- Environmental Specification
- External Power
MANUFACTURING
PCB fabrication, electronic assembly and IC Packaging
PCB Manufacturing
The PCB Manufacturing group brings together companies to focus on the challenges and demands of the industry, from materials, to supply chain and manufacturing techniques.
Typical Focus topics include :
- Material Selection
- Manufacturing Techniques
- Supply Chain
- Performance
Electronic Assembly
The assembly group brings together companies to focus on the challenges and demands of the industry, from process solutions, manufacturing techniques and challenges and best practice.
Typical Focus topics include :
- Processes
- Equipment
- Materials
- Inspection
- Test
IC Packaging
The IC packaging group brings together companies to focus on the challenges and demands of the industry, from materials and manufacturing issues.
Typical Focus topics include :
- Materials
- Inspection
- Failure Analysis
- Test
- Marking
- Supply Chain
VERTICAL INCUBATOR
Focussed working groups around specific market or application sectors.
AI & ML
The AI & ML group is focussed on the industry challenges of developing AI based systems.
Working across 3 streams – AI Best Practice, Use of AI in IC Development and AI in System Design. The aim of the group is to create industry accepted application guides and recognised documentation for anyone developing an AI system to gain from.
Technology Innovation Network
The innovation support network is a community focussed on deep tech & semiconductor start-ups.
The group brings together start-ups of all types to collaborate, to meet their peers and connect them to industry. Creating events and activities for this very important area of the UK electronics market. The aim of the group is to support its members from initial concept through to full production, by working within the TechNES groups, the technology innovation network members are able to work across the groups and get involved with all TechNES members – connecting them to industry leaders that they might not normally have access to.
Large Area Electronics
Large-Area Electronics (LAE) is a new way of making electronics, including printed, flexible, hybrid, plastic, organic and bioelectronics.
The LAE group is focussed on members and companies developing printable electronics solutions. LAE members are able to work across all groups and get involved with all TechNES members – connecting them to industry leaders that they might not normally have access to, focussed on new materials that can be processed at low-temperatures, the use of new manufacturing processes such as printing and digital fabrication for electronics and looking at products with new form factors, new cost structures and the potential for customisation.
Agri Tech
The Agri Tech group is focussed on members and companies developing electronics solutions for the growing demands of the agriculture sector.
The aim of the group is to support its members from initial concept through to full production, by working within the TechNES groups, the agritech members are able to work across all groups and get involved with all TechNES members – connecting them to industry leaders that they might not normally have access to.
Life Sciences
The life sciences group is focussed on members and companies developing electronics solutions for the growing demands of the life science sector.
The aim of the group is to support its members from initial concept through to full production, by working within the TechNES groups, these members are able to work across all groups and get involved with all TechNES members – connecting them to industry leaders that they might not normally have access to.
Green Energy
The Green Energy group is focussed on members and companies developing electronics solutions for the growing demands of the green energy sector.
The aim of the group is to support its members from initial concept through to full production, by working within the TechNES groups, these members are able to work across all groups and get involved with all TechNES members – connecting them to industry leaders that they might not normally have access to.
RESEARCH HUB
Connecting industry to academia and vice versa.
The TechNES research hub works closely with our sister organisation AESIN (https://aesin.org.uk) and is to better connect academia to industry.
The board liaises directly with universities to understand what research projects are being looked at, and what support they might need from industry, by identifying research projects early, TechNES can involve its members to benefit all.
Industry often has design challenges; The Hub is there to find out from TechNES members what these are and to see if academia can help.